In the middle of this month, the ITF forum was held in Tokyo, Japan. At the forum, IMEC, a Belgian semiconductor research institute that cooperates with ASML (ASML) to develop photoresists, announced the technical details of the processes of 3nm and below at the micro level. At least for now, ASML has made clear route planning for 3M, 2nm, 1.5nm, 1nm and even sub 1nm, and the volume of lithography machine in 1nm era will increase a lot. < / P > < p > it is said that EUV exposure equipment with Na = 0.33 has been introduced in the current 7Nm and 5nm manufacturing of TSMC and Samsung, and a higher resolution exposure equipment with Na = 0.55 is needed after 2nm. Fortunately, ASML has completed the basic design of 0.55na exposure equipment (namely nxe: 5000 Series), which is expected to be commercialized in 2022. Global Tech