On November 23, according to foreign media reports, Google and AMD are helping TSMC test and verify 3D stack packaging technology, which will become the first batch of customers of TSMC chip packaging technology. Foreign media quoted sources as saying that Google and AMD are helping TSMC test 3D stack packaging technology, which is expected to start large-scale production in 2022. < p > < p > TSMC’s 3D stack packaging technology can encapsulate different types of chips, such as processors, memories and sensors, into one entity, which can make chipsets smaller in size, stronger in performance, and improve energy efficiency. According to reports from foreign media, Google and AMD help TSMC test and verify 3D stack packaging technology, hoping to use TSMC’s packaging technology in their chips as soon as possible to improve the performance of their products. According to

sources, Google is planning to use 3D stack encapsulation technology to encapsulate the chips needed for autopilot systems and other applications. Another source revealed that AMD, as a competitor of Intel microprocessors, is eager to make use of the latest chip packaging technology, hoping to make products stronger than Intel. Global Tech

By ibmwl