In the past year, Huawei Hisilicon has become the “support” of Huawei’s various business lines. According to the latest report of the organization, the chip company has ranked among the top 10 semiconductor manufacturers in the world with a growth rate of 49%. According to the ranking of the world’s top 10 semiconductor factories published by IC insights, the top five are Intel, Samsung, TSMC, Hynix and micron, and the sixth to tenth are Broadcom, Qualcomm, Texas Instruments, NVIDIA and Hisilicon.
from the perspective of revenue growth, Hisilicon has the fastest growth rate, with revenue of $5.2 billion in the first half of the year. In the same period last year, Hisilicon ranked 16th.
facing the pressure of external continuous upgrading, the internal adjustment speed of Hisilicon is also accelerating. A few days ago, it was reported that Huawei has officially launched the “Tashan plan” to take root in semiconductors in an all-round way, and has begun to cooperate with relevant enterprises to build a 45nm chip production line without American technology. It is expected to be completed within this year. Meanwhile, it is exploring cooperation to establish a 28nm autonomous technology chip production line.
Huawei did not respond to this. However, some Huawei insiders told the first finance and economics reporter that they were exploring self built or cooperative wafer foundry production lines to ensure the long-term operation of Huawei’s various product lines.
in May last year, he Tingbo, the person in charge of Huawei’s chip business, said in an internal letter: “all the spare tires Huawei once built will become regular overnight! Many years of hard work, in one night to fulfill the company’s commitment to continuous customer service. Yes, these efforts have been linked together to reverse the current situation and ensure the strategic safety and continuous supply of most of the company’s products. ”
Hisilicon, whose full name is Hisilicon Semiconductor Co., Ltd., was formally established in October 2004 and is responsible for Huawei’s own chip design. Among them, the Kirin series of Huawei mobile phone chips well known to the outside world is from Hisilicon. In addition to mobile phone chips, Hisilicon’s products include server chips (Kunpeng Series), base station chips, baseband chips, AI chips, etc. Headquartered in Shenzhen, Hisilicon has design divisions in Beijing, Shanghai, Silicon Valley and Sweden.
it is worth noting that in the above-mentioned rankings, Hisilicon replaced Infineon in the first quarter of this year, climbing to the 10th place from the 16th in the same period last year, becoming the first mainland semiconductor company to enter the top ten semiconductor companies in China. However, IC insights believes that due to the influence of the US ban, the time for Hisilicon to enter the top 10 may be short.
Yu Chengdong, CEO of Huawei’s consumer business, said at the 100 people’s Conference on China’s informatization held on August 7 that mate 40 Qilin 9000 chip is likely to become the last generation of Kirin high-end chips. He called on partners in the semiconductor industry chain to take root in all aspects.
in a ppt on the spot of the above conference, Huawei suggested that the industry should pay attention to EDA and IP fields, key algorithms and design capabilities in terms of “root technology”. There are also 12 inch wafer, mask, EUV light source, immersion system, lens and other production equipment and material fields. In the process of design and manufacture, we pay attention to the ability of IC design, IC manufacture and IC seal test. IDM covers RF, power, analog, storage, sensor and other design and manufacturing process integration.
it is reported that Huawei has officially launched the “Tashan plan” internally, preparing to build a 45nm chip production line without us technology, including Shanghai microelectronics, Shenyang Xinyuan (Xinyuan micro), shengmei, North Huachuang, Zhongwei, Shenyang tuojing, Shenyang Zhongke, Chengdu Nanke, Huahai Qingke, Beijing Zhongkexin, Shanghai kaishitong (Wanye enterprise) Dozens of enterprises, including China Science flight test, Shanghai Ruili, Shanghai Precision Measurement (precision measurement electronics), Keyi Hongyuan, Zhongke Jingyuan, Qingyi optoelectronics, etc., have entered the list of Huawei’s planned cooperation.
according to the statistics of the first finance and economics reporter, within one year, Huawei has invested more than ten semiconductor enterprises, including the third generation semiconductor material enterprises.
in August 2019, Huawei’s Hubble Technology Investment Co., Ltd. invested in Shandong Tianyue Advanced Materials Technology Co., Ltd., holding 10% of the shares. It is reported that Shandong Tianyue is a leading enterprise of silicon carbide, the third generation semiconductor material in China.
Huachuang Securities believes that “those who get silicon carbide get the world”. Silicon carbide is an ideal substrate material for manufacturing high temperature, high frequency and high power semiconductor devices. Its comprehensive performance can be improved by thousands of times compared with silicon material. It is known as the “core” of solid-state light source, power electronics and microwave RF devices, and is the “new engine” of optoelectronic and microelectronics industries. After the mass production of SiC material, it will break the foreign monopoly and promote the domestic 5g chip technology and production capacity.
before that, many international companies have invested in silicon carbide. For example, Infineon has acquired a start-up company, silectra, for us $139 million, to further enter the silicon carbide market. In addition, x-fab, Mitsubishi, Italian semiconductor and other enterprises also announced that they will develop more silicon carbide power devices.
Zhang Rujing, former founder and CEO of SMIC international and general manager of Shanghai Xinsheng, and now founder and chairman of Xinen (Qingdao), said in an online conference that the United States is not so strong in restraining China, and I believe it can catch up.
“IDM is the mainstream of the third generation semiconductor, and foundry also has opportunities, but for design companies, it needs to find a foundry that can cooperate for a long time.” Zhang Rujing said that the application of the third generation semiconductor materials will focus on silicon carbide, which is a very good material, but it may encounter bottlenecks in the three stages of its production. The first is the single crystal of silicon carbide, the second is the production of epitaxial wafers, and the third is the production of semiconductors of various powers. However, China’s technology in material manufacturing is relatively weak.
the white paper on talents in China’s integrated circuit industry (2017-2018) points out that around 2020, the demand for talents in China’s integrated circuit industry will be about 720000, while the existing talent stock in China is 400000, and the talent gap will reach 320000.
“intelligent semiconductors have entered the era of the third generation semiconductors from the second generation. We hope to take the lead in a new era, whether it is overtaking on a curve or half way. There is nothing that can’t be done in the world, only not enough determination and not enough investment. ” Yu Chengdong said.