The first integrated liquid cooling system in microchip is reported by EPFL research team in Lausanne, Switzerland. This new system shows excellent cooling performance compared with traditional electronic cooling methods. This result means that it will be a promising, sustainable and cost-effective method to control the heat generated by electronic products by embedding liquid cooling directly into electronic chips. < / P > < p > with the continuous improvement of data generation and communication speed around the world, and the continuous efforts to reduce the size and cost of industrial converter systems, the demand for small devices is increasing, which makes the cooling of electronic circuits extremely challenging. Generally speaking, water system can be used to cool electronic devices, but this cooling method is inefficient and has more and more impact on the environment. For example, data centers in the United States alone use 24 terawatt hours of electricity and 100 billion liters of water a year for cooling, which is comparable to the water consumption of a city the size of Philadelphia. < p > < p > engineers believe that it is a promising and attractive method to embed liquid cooling directly into the microchip, but the current design includes a separate chip manufacturing system and a cooling system, which limits the efficiency of the cooling system. < p > < p > in view of this, Alison metriori, a researcher at the Federal Institute of technology in Lausanne, and his colleagues described a new integrated cooling method, in which a microfluidic based radiator and electronic device were co designed and manufactured in the same semiconductor substrate. The researchers report that the cooling power can reach up to 50 times the traditional design. The cooling of electronic circuits is considered to be one of the most important challenges of electronic products in the future. The team concluded that cooling in general usually results in huge energy and water consumption, which has a growing impact on the environment, and now people need new technologies to cool in a more sustainable way, in other words, less water and energy. < / P > < p > for the new results, the researchers believe that this can further miniaturize the electronic equipment, expand Moore’s law and greatly reduce the energy consumption in the cooling process of electronic equipment. By eliminating the need for large external radiators, they say, it could also allow more compact electronic devices, such as power converters, to be integrated into a single chip. Spontaneous combustion at a Guangzhou Motor vehicle intersection and other traffic lights in Shenzhen