The large-scale UV 3D direct writing lithography equipment igrapher 3000 has been put into industrial operation in Sunda Weige technology group. Igrapher 3000 is mainly used for 3D lithography of micro nano structure on large substrate. It is a new platform for the design, development and manufacture of novel materials and advanced optoelectronic devices. It can be called the cornerstone equipment of optoelectronic industry and create new opportunities for industrial cooperation.
from planar lithography of integrated circuit graphics to 3D lithography of “microstructure morphology” of optoelectronics, igrapher 3000 provides advanced means for novel materials and functional optoelectronic devices. The following figure shows the photos of igrapher 3000 UV 3D lithography equipment (110 inch format, 2500mmx1500mm) and SEM photos of micro nano structure morphology.
the first industrial application project of igrapher 3000 installed in the yellow light workshop of Weiyida Technology Co., Ltd. is the deep groove structure microcircuit mold with large size transparent conductive film, which will be used for large area flat panel imaging, flexible conductive devices, holographic display and 3D display and industrial application.
the operation of igrapher3000 provides key support for the industrial cooperation in the field of new optoelectronic materials / devices, new display and sensing fields for susda Weige technology group and its strategic cooperation units, and has established strategic cooperative relations with several leading enterprises in the industry.
with the gradual empowerment of IOT and 5g, innovative development opportunities will be ushered in such fields as new display, flexible sensing, automatic driving, virtual reality fusion, super structural materials and flat panel imaging.
the frontier scientific research shows that “the singular electromagnetic field characteristics generated by the interaction between micro nano structure interface and photoelectron is a new way to design novel materials and devices (such as super structure materials, super structure holographic display, super structure plane imaging, etc.). At present, the main obstacle to the practical application of novel materials and super structured surfaces is the lack of technical means to prepare micro nano structures on large substrates! The precision machining methods, including ultra precision diamond lathe, electron beam lithography, and extreme ultraviolet projection lithography equipment for chips, are not competent for the efficient processing of complex micro and nano structures. So the core problem is, how to design large aperture photonic devices with new functions? How to transform massive data into large area micro nano structure? Therefore, the development and application of large area 3D direct writing lithography technology and equipment is of great significance to a new round of industrial innovation and frontier scientific research.
firstly, the amount of data to express the “micro nano structure morphology” is very large, for example, the data amount of 55 inch transparent circuit graphics is about 15tb, and that of flat lens with the same size is & gt; 150tb;
led by Dr. Weige pudonglin of Sunda University, he has been developing 3D lithography technology, nano lithography hardware and software, data processing algorithm and precision control technology for more than ten years. After several rounds of iteration, the major bottleneck of 3D lithography has been overcome, and a series of UV 3D direct writing lithography equipment represented by igrapher 3000 has been successfully developed and applied in industry.
igrapher 3000 is the first to realize continuous micro structure large area flat panel device on 110 inch format glass substrate, with the depth range of 50 nm ~ 20 μ m; it is the first to establish the mass data processing capacity and transform it into the designed micro nano structure morphology, involving a single file data volume of 600tb; it is the first to establish the support of 110 inch photoresist thick glue process (2 μ m ~ 25 μ m) for subsequent plate printing Industrial production.
in chip, optoelectronics, display industry and scientific research, lithography is a basic process. High end lithography equipment has been monopolized by foreign enterprises for a long time.
in the chip industry, there are two types of photolithography: the first is projection lithography, which miniaturizes the photomask pattern and photoetchs it onto a silicon wafer to prepare integrated circuit graphics with the thinnest line width of 5nm, such as ASML EUV projection lithography machine. Japanese Nikon I series and Canon FPA series high precision stepper projection lithography; the second is direct writing Lithography) is used for the preparation of chip photomask with nodes of 0.25 μ m and above, and partial photomask below 0.18 μ m (the rest are prepared by electron beam lithography EBL, accounting for about 25%), such as the Alta lithography machine of American applied materials company (AM); in the display panel industry, such as mycronic company of Sweden, prevision10 laser direct writing lithography system is used for 10th generation line photomask Nikon large projection scanning lithography machine (FX Series) is used to scan and photolithography photomask patterns onto large size substrates to form TFT circuit patterns. Therefore, in the field of IC integrated circuit, display panel and other fields, the function of direct writing lithography is to prepare the design data on the photoresist substrate to become a photomask, which is used for the reproduction of back projection lithography.
both of the above two types of lithography belong to “planar pattern” lithography, which are used in thin photoresist process. Both direct writing lithography and projection lithography are the key equipment of integrated circuit and optoelectronic industry. Direct writing lithography belongs to the source type key link, which is called pattern generator.
this time, igrapher 3000 has been put into operation. The “3D morphology” lithography is a thick glue process, which is mainly used for the preparation of optoelectronic materials and devices. The function is to prepare the design data on the thick photoresist substrate to form a nano printing plate with three-dimensional morphology, which is used for subsequent imprinting and replication. The following figure shows the SEM photos of microstructure morphology for 3D display.
the powerful 3D lithography function of igrapher3000: exposure in 3D navigation flight scanning mode, forming 3D micro nano structure morphology by one scanning exposure; supporting multi format 2D and 3D model data files, supporting lithography of hundreds of TB data, with writing speed greater than 3gbps; fast lithography function of data processing / transmission / writing synchronization; format: 110 inches; lithography depth range: 50 Nanometer ~ 20 μ M @ depth resolution 10nm, transverse linewidth & gt; 0.5 μ M @ digital resolution [email protected] The maximum scanning rate is 1 m / s.
in theory, the morphology of micro nano structure has 5-Dimensional controllable variables, which supports the design and preparation of various light field and electromagnetic length control materials and devices. The following figure shows the SEM photos of the micrographer 3000 micro and nano structure morphology prepared on large area substrate for various purposes.
as a comparison, it is used in chip extreme ultraviolet projection lithography (EUV) to pursue ultra-fine linewidth (up to 5nm). The difficulty lies in extreme precision control and high yield (EUV light source, motion platform and lithography precision). For projection lithography of chips, photomask pattern miniaturization and replication does not involve mass data processing; direct writing lithography equipment (LDW) for photomask The regular circuit pattern is transformed into a photomask to form a TFT mask. Different from the thin glue lithography technology of integrated circuits, 3D lithography for micro nano structure topography pursues morphology and relative alignment accuracy (according to different applications). The difficulty lies in massive data processing and transmission (hundreds of TB), large area structure function design and advanced algorithm, 3D lithography and 3D proximity effect compensation and other fidelity technologies. The depth range is 50nm ~ 20um, and the precision range is 1 nm~100nm。 It can be seen that 3D lithography is different from 2D lithography in function and application.
igrapher3000 has opened up a new channel for the research and industrial innovation of novel optoelectronic materials and functional devices. It is mainly used for the preparation of micro nano morphology and deep structure including large-scale optoelectronic devices, super structured surface materials, functional optoelectronic devices, etc., including large-scale transparent circuit graphics, high-precision flexible touch sensors, high-resolution projection screen, holographic 3D display, miniled circuit backplane, high light efficiency uniform plate, virtual reality fusion photonic devices, large-diameter transparent electromagnetic shielding materials, etc.
igrapher3000 can also be used for photomask preparation in flat panel display industry and flexible electronic industry, and provides strategic R & D resources for the design and preparation of high-precision large aperture thin film lens.
we have a solid foundation in the field of lithography technology and equipment. We have developed a variety of lithography equipment miscan200 (8 “~ 12”) for MEMS chips, microlab (4 “~ 8”) for micro nano optics and nanocrystal (8 “~ 32”) for ultra surface, naked eye 3D display and optoelectronic device research. These new lithography devices are widely used in enterprises and colleges and universities, which solve the neck problem in many fields of research in China, and provide independent and controllable advanced means for the research and development of new optoelectronic devices, new materials, MEMS chips and sensor devices.
on January 10, 2020, at the national science and technology award conference, the achievements of “key technologies and applications of micro / nano manufacturing for flexible optoelectronics” undertaken by sutavige won the second prize of national science and technology progress award.